Room-temperature bonding technique based on copper nanowire surface fastener

Peng Wang, Yang Ju*, Mingji Chen, Atsushi Hosoi, Yuanhui Song, Yuka Iwasaki

*この研究の対応する著者

研究成果: Article査読

13 被引用数 (Scopus)

抄録

A free-standing copper nanowire array was directly fabricated on a silicon substrate by improved template-assisted electrodeposition. A roomtemperature bonding technique was realized by pressing two nanowire arrays against each other. The van der Waals forces between the interconnected nanowires contributed to the room-temperature bonding which exhibited good mechanical and electrical properties. Theoretical analysis further showed that a much higher mechanical strength can be obtained if most copper nanowires could interconnect with each other.

本文言語English
論文番号035001
ジャーナルApplied Physics Express
6
3
DOI
出版ステータスPublished - 2013 3月
外部発表はい

ASJC Scopus subject areas

  • 工学(全般)
  • 物理学および天文学(全般)

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