A free-standing copper nanowire array was directly fabricated on a silicon substrate by improved template-assisted electrodeposition. A roomtemperature bonding technique was realized by pressing two nanowire arrays against each other. The van der Waals forces between the interconnected nanowires contributed to the room-temperature bonding which exhibited good mechanical and electrical properties. Theoretical analysis further showed that a much higher mechanical strength can be obtained if most copper nanowires could interconnect with each other.
ASJC Scopus subject areas