Secure deduplication in a multiple group signature setting

Ei Mon Cho, Takeshi Koshiba

研究成果: Conference contribution

抜粋

Multiple group setting schemes have recently become important for enabling deduplication for cloud servers. We consider a new primitive, cross-group deduplication, allowing the multiple groups by the group signature features. We propose a new framework DDUP-MUG (deduplication for the multiplegroup signature scheme) that allows one or more groups to accessa file such that the cloud storage server can avoid duplicates according to the ownership of the file. The main goal of the primitive is allowing to multiple groups with individual management and several clients from different groups who attempt tostore an identical message on the server. In this paper, the group managers mainly manage the new entities and produce revocation lists for clients and the server respectively. We use Message Lock Encryption (MLE) as an ingredient for deduplication and weprovide new three protocols, namely UPL-Dup (for uploading a new message), EDT-Dup (for editing the existing message) and DEL-Dup (for eliminating the existing message) in the DDUPMUG framework.

元の言語English
ホスト出版物のタイトルProceedings - 31st IEEE International Conference on Advanced Information Networking and Applications, AINA 2017
出版者Institute of Electrical and Electronics Engineers Inc.
ページ811-818
ページ数8
ISBN(電子版)9781509060283
DOI
出版物ステータスPublished - 2017 5 5
外部発表Yes
イベント31st IEEE International Conference on Advanced Information Networking and Applications, AINA 2017 - Taipei, Taiwan, Province of China
継続期間: 2017 3 272017 3 29

Other

Other31st IEEE International Conference on Advanced Information Networking and Applications, AINA 2017
Taiwan, Province of China
Taipei
期間17/3/2717/3/29

ASJC Scopus subject areas

  • Engineering(all)

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  • これを引用

    Cho, E. M., & Koshiba, T. (2017). Secure deduplication in a multiple group signature setting. : Proceedings - 31st IEEE International Conference on Advanced Information Networking and Applications, AINA 2017 (pp. 811-818). [7920991] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/AINA.2017.43