Self-alignment method on a temperature-controlled transfer

Eiji Iwase*, Hiroaki Onoe, Akihito Nakai, Kiyoshi Matsumoto, Isao Shimoyama

*この研究の対応する著者

研究成果: Article査読

抄録

We propose a method to fix the positioning error of transferred bare chips on a substrate after the Temperature-Controlled Transfer (TCT) that we have previously developed. This TCT method is important for large area integration of heterogeneous materials. In the TCT process, the bare chips on an adhesive sheet are transferred and electrically connected to the substrate via Low-Melting Point Solder (LMPS). We reflowed the LMPS and used the surface tension of the LMPS to self-align the bare chips in position on the substrate. We experimentally confirmed that the self-alignment works when contact pads on the bare chip and the substrate were overlapped. The positioning error after the self-alignment process was within 0-15 % of the contact pad size.

本文言語English
ページ(範囲)188-193+7
ジャーナルieej transactions on sensors and micromachines
130
5
DOI
出版ステータスPublished - 2010 6月 21
外部発表はい

ASJC Scopus subject areas

  • 機械工学
  • 電子工学および電気工学

フィンガープリント

「Self-alignment method on a temperature-controlled transfer」の研究トピックを掘り下げます。これらがまとまってユニークなフィンガープリントを構成します。

引用スタイル