Self-alignment method on a temperature-controlled transfer

Eiji Iwase, Hiroaki Onoe, Akihito Nakai, Kiyoshi Matsumoto, Isao Shimoyama

研究成果: Article

抄録

We propose a method to fix the positioning error of transferred bare chips on a substrate after the Temperature-Controlled Transfer (TCT) that we have previously developed. This TCT method is important for large area integration of heterogeneous materials. In the TCT process, the bare chips on an adhesive sheet are transferred and electrically connected to the substrate via Low-Melting Point Solder (LMPS). We reflowed the LMPS and used the surface tension of the LMPS to self-align the bare chips in position on the substrate. We experimentally confirmed that the self-alignment works when contact pads on the bare chip and the substrate were overlapped. The positioning error after the self-alignment process was within 0-15 % of the contact pad size.

元の言語English
ジャーナルIEEJ Transactions on Sensors and Micromachines
130
発行部数5
DOI
出版物ステータスPublished - 2010
外部発表Yes

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Soldering alloys
Melting point
Substrates
Temperature
Surface tension
Adhesives

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Mechanical Engineering

これを引用

Self-alignment method on a temperature-controlled transfer. / Iwase, Eiji; Onoe, Hiroaki; Nakai, Akihito; Matsumoto, Kiyoshi; Shimoyama, Isao.

:: IEEJ Transactions on Sensors and Micromachines, 巻 130, 番号 5, 2010.

研究成果: Article

Iwase, Eiji ; Onoe, Hiroaki ; Nakai, Akihito ; Matsumoto, Kiyoshi ; Shimoyama, Isao. / Self-alignment method on a temperature-controlled transfer. :: IEEJ Transactions on Sensors and Micromachines. 2010 ; 巻 130, 番号 5.
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