This paper describes three-dimensional (3-D) microstructure assembly using an external magnetic field. An external magnetic field perpendicular to a substrate lifts up a hinged structure due to the shape magnetic anisotropy. Micro flap structures (4.5 μm-thick electroplated Permalloy) having 0.2 μm-thick nickel elastic hinges with various lengths and widths are bent in out-of-plane direction in a magnetic field up to 50 kA/m. The volume of magnetic material and the stiffness of the hinges determine the sensitivity to a magnetic field. As a result, we realized sequential batch assembly using the difference of the sensitivity. By way of the example, we have erected plates 600 μm × 600 μm in size. Also, structures bent at 90 and 45 degrees out of the plane have been obtained at the same time.
|出版ステータス||Published - 2002 1 1|
|イベント||15th IEEE International Conference on Micro Electro Mechanical Systems MEMS 2002 - Las Vegas, NV, United States|
継続期間: 2002 1 20 → 2002 1 24
|Conference||15th IEEE International Conference on Micro Electro Mechanical Systems MEMS 2002|
|City||Las Vegas, NV|
|Period||02/1/20 → 02/1/24|
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