Significant reduction of wire sweep using Ni plating to realise ultra fine pitch wire bonding

Shinichi Terashima*, Yukihiro Yamamoto, Tomohiro Uno, Kohei Tatsumi

*この研究の対応する著者

研究成果: Conference article査読

11 被引用数 (Scopus)

抄録

Significant reduction of the wire sweep in molding is proposed because the wire sweep is considered to be the major problem to realise wire bonding with ultra fine pitches of under 30 micrometers. In the present proposal, Ni was plated for several micrometers before molding on bonded Au wires. Ni plating was carried out by means of electroless plating for several minutes in the aqueous solution kept at 358K containing Ni and P. The wire sweep ratio for Ni plated wire (total diameter was 21 micrometers) was almost half of that for Au wire with the diameter of 15 micrometers except Ni plate, and was slightly smaller than that for Au wire with the diameter of 25 micrometers except Ni plate even the total diameter was smaller. It is considered that wire sweep suppression by this technique was due to the enhancement of both elastic and plastic properties.

本文言語English
ページ(範囲)891-896
ページ数6
ジャーナルProceedings - Electronic Components and Technology Conference
出版ステータスPublished - 2002 1 1
外部発表はい
イベント52nd Electronic Components and Technology Conference - San Diego, CA, United States
継続期間: 2002 5 282002 5 31

ASJC Scopus subject areas

  • 電子材料、光学材料、および磁性材料
  • 電子工学および電気工学

フィンガープリント

「Significant reduction of wire sweep using Ni plating to realise ultra fine pitch wire bonding」の研究トピックを掘り下げます。これらがまとまってユニークなフィンガープリントを構成します。

引用スタイル