Simple and Rapid Fabrication Process of Porous Silicon Surface Using Inductively Coupled Plasma Reactive Ion Etching

Engineering & Materials Science

• Inductively coupled plasma 100%
• Plasma etching 99%
• Porous silicon 99%
• Reactive ion etching 90%
• Etching 72%
• Fabrication 49%
• Passivation 27%
• Flow of gases 21%
• Surface roughness 18%
• Flow rate 16%
• Experiments 7%