Simultaneous fabrication of a through-glass interconnect via and bumps using dry filling process of submicron gold particles

Kazuya Nomura, Akiko Okada, Shuichi Shoji, Toshinori Ogashiwa, Jun Mizuno

研究成果: Conference contribution

抄録

We propose a technique for the simultaneous fabrication of a through-glass interconnect via (TGV) and Au bumps using dry filling process of submicron Au particles. First, dry film resist holes were fabricated over glass through holes by photolithography. Next, submicron Au particles were filled into both the glass and resist holes, and sintered. We define a TGV sandwiched between two Au bumps as I-structure TGV. Cross-sectional SEM images showed that the proposed I-structure TGV was successfully fabricated without significant voids. Furthermore, the glass substrate covered with thin Au film and the Au bumps were well sealed because the Au particles shrank during a sintering. Four-probe method using daisy chain revealed that the resistance of the single I-structure TGV was 0.11 Ω. These results indicate that the proposed fabrication method will be very useful for various applications of glass interposers or glass IC chips.

本文言語English
ホスト出版物のタイトル11th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2016 - Proceedings
出版社IEEE Computer Society
ページ270-272
ページ数3
ISBN(電子版)9781509047697
DOI
出版ステータスPublished - 2016 12 27
イベント11th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2016 - Taipei, Taiwan, Province of China
継続期間: 2016 10 262016 10 28

Other

Other11th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2016
国/地域Taiwan, Province of China
CityTaipei
Period16/10/2616/10/28

ASJC Scopus subject areas

  • ハードウェアとアーキテクチャ
  • 制御およびシステム工学
  • 電子工学および電気工学

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