Sn-Bi added Ag-based transient liquid phase sintering for low temperature bonding

    研究成果: Conference contribution

    4 被引用数 (Scopus)

    抄録

    A low temperature and low pressure fluxless bonding of plateless Cu-Cu substrates has been achieved by transient liquid phase sintering of Ag and Sn-Bi eutectic powder mixture in a formic acid reducing environment. The effects of Sn-Bi addition amount and sintering temperature to the shear strength and microstructure were investigated. Remelting temperature of the sintered paste was also examined. Shear strength of 30 weight percentage added Sn-Bi that was sintered at 250°C was over than 20 MPa. The microstructure varied with the Sn-Bi addition amount, however, mainly consisted of Ag solid solution and/or Ag-Sn intermetallic compounds (IMCs), Bi-rich phase and Cu-Sn IMCs. No remelting event at Sn-Bi eutectic temperature was observed and the remelting temperature shifted to approximately 262°C, implying the possibility for higher operation temperature although the processing was performed at lower temperature.

    本文言語English
    ホスト出版物のタイトルProceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017
    出版社Institute of Electrical and Electronics Engineers Inc.
    ページ数1
    ISBN(電子版)9784904743034
    DOI
    出版ステータスPublished - 2017 6 13
    イベント5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017 - Tokyo, Japan
    継続期間: 2017 5 162017 5 18

    Other

    Other5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017
    CountryJapan
    CityTokyo
    Period17/5/1617/5/18

    ASJC Scopus subject areas

    • Electrical and Electronic Engineering
    • Industrial and Manufacturing Engineering
    • Electronic, Optical and Magnetic Materials
    • Surfaces, Coatings and Films

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