Solder/adhesive bonding using simple planarization technique for 3D integration

Masatsugu Nimura, Jun Mizuno, Katsuyuki Sakuma, Shuichi Shoji

研究成果: Conference contribution

11 被引用数 (Scopus)

抄録

This paper describes a hybrid solder/adhesive bonding method using a simple planarization technique for three-dimensional (3D) integration. With the hybrid bonding method, the chip bonding and encapsulation of underfill resin between chips is completed in one step. The simple planarization technique is used to planarize adhesive on a flat Si substrate coated with a release agent. The planarization technique is a simple and inexpensive operation compared to the conventional processes using Chemical Mechanical Polishing (CMP) or fly cutting. Since the CMP process has advantages for wafer-level fabrication, we also evaluated hybrid bonding using CMP. The results of the simple planarization process show that the spaces around the Cu/Sn bumps were fully filled with the adhesive, and the adhesive residual layer on the Cu/Sn bumps was removed by O2 plasma. A cross-sectional SEM image after the hybrid bonding using the proposed planarization process shows that the Cu/Sn solder had properly wetted the Au and the adhesive had uniformly filled the small gaps between the bonded chips. Solder/adhesive bonding using CMP was also succeeded. In addition, Au/adhesive bonding with 10-μm pitch Au bumps was realized.

本文言語English
ホスト出版物のタイトル2011 IEEE 61st Electronic Components and Technology Conference, ECTC 2011
ページ1147-1152
ページ数6
DOI
出版ステータスPublished - 2011 7 21
イベント2011 61st Electronic Components and Technology Conference, ECTC 2011 - Lake Buena Vista, FL, United States
継続期間: 2011 5 312011 6 3

出版物シリーズ

名前Proceedings - Electronic Components and Technology Conference
ISSN(印刷版)0569-5503

Conference

Conference2011 61st Electronic Components and Technology Conference, ECTC 2011
国/地域United States
CityLake Buena Vista, FL
Period11/5/3111/6/3

ASJC Scopus subject areas

  • 電子材料、光学材料、および磁性材料
  • 電子工学および電気工学

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