Stress-free stretchable electronic device using folding deformation

Yoshitaka Iwata*, Eiji Iwase

*この研究の対応する著者

    研究成果: Conference contribution

    17 被引用数 (Scopus)

    抄録

    We developed a two-dimensionally (2-D) stretchable electronic device with stress-free region by applying origami folding. The key idea is to achieve 'a stretching deformation of whole device' by 'a local bending deformation'. Because our device has stress-free region, we can use a rigid chip (such as LED chips and MEMS sensors) and a metal wire without mechanical fracture or metal fatigue. In this paper, first, we proposed a 2-D stretchable structure by developing 'miura-ori' folding. Next, we fabricated a 2-D stretchable electronic device, and confirmed that wire fatigue or cracks are not generated by repeated deformation. Finally, we demonstrated 2-D stretchability and bendability using the device with inorganic LED chips.

    本文言語English
    ホスト出版物のタイトル2017 IEEE 30th International Conference on Micro Electro Mechanical Systems, MEMS 2017
    出版社Institute of Electrical and Electronics Engineers Inc.
    ページ231-234
    ページ数4
    ISBN(電子版)9781509050789
    DOI
    出版ステータスPublished - 2017 2月 23
    イベント30th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2017 - Las Vegas, United States
    継続期間: 2017 1月 222017 1月 26

    Other

    Other30th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2017
    国/地域United States
    CityLas Vegas
    Period17/1/2217/1/26

    ASJC Scopus subject areas

    • 電子材料、光学材料、および磁性材料
    • 凝縮系物理学
    • 機械工学
    • 電子工学および電気工学

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