抄録
We developed a two-dimensionally (2-D) stretchable electronic device with stress-free region by applying origami folding. The key idea is to achieve 'a stretching deformation of whole device' by 'a local bending deformation'. Because our device has stress-free region, we can use a rigid chip (such as LED chips and MEMS sensors) and a metal wire without mechanical fracture or metal fatigue. In this paper, first, we proposed a 2-D stretchable structure by developing 'miura-ori' folding. Next, we fabricated a 2-D stretchable electronic device, and confirmed that wire fatigue or cracks are not generated by repeated deformation. Finally, we demonstrated 2-D stretchability and bendability using the device with inorganic LED chips.
本文言語 | English |
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ホスト出版物のタイトル | 2017 IEEE 30th International Conference on Micro Electro Mechanical Systems, MEMS 2017 |
出版社 | Institute of Electrical and Electronics Engineers Inc. |
ページ | 231-234 |
ページ数 | 4 |
ISBN(電子版) | 9781509050789 |
DOI | |
出版ステータス | Published - 2017 2月 23 |
イベント | 30th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2017 - Las Vegas, United States 継続期間: 2017 1月 22 → 2017 1月 26 |
Other
Other | 30th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2017 |
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国/地域 | United States |
City | Las Vegas |
Period | 17/1/22 → 17/1/26 |
ASJC Scopus subject areas
- 電子材料、光学材料、および磁性材料
- 凝縮系物理学
- 機械工学
- 電子工学および電気工学