Stress-free stretchable electronic device using folding deformation

Yoshitaka Iwata, Eiji Iwase

    研究成果: Conference contribution

    8 引用 (Scopus)

    抜粋

    We developed a two-dimensionally (2-D) stretchable electronic device with stress-free region by applying origami folding. The key idea is to achieve 'a stretching deformation of whole device' by 'a local bending deformation'. Because our device has stress-free region, we can use a rigid chip (such as LED chips and MEMS sensors) and a metal wire without mechanical fracture or metal fatigue. In this paper, first, we proposed a 2-D stretchable structure by developing 'miura-ori' folding. Next, we fabricated a 2-D stretchable electronic device, and confirmed that wire fatigue or cracks are not generated by repeated deformation. Finally, we demonstrated 2-D stretchability and bendability using the device with inorganic LED chips.

    元の言語English
    ホスト出版物のタイトル2017 IEEE 30th International Conference on Micro Electro Mechanical Systems, MEMS 2017
    出版者Institute of Electrical and Electronics Engineers Inc.
    ページ231-234
    ページ数4
    ISBN(電子版)9781509050789
    DOI
    出版物ステータスPublished - 2017 2 23
    イベント30th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2017 - Las Vegas, United States
    継続期間: 2017 1 222017 1 26

    Other

    Other30th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2017
    United States
    Las Vegas
    期間17/1/2217/1/26

    ASJC Scopus subject areas

    • Electronic, Optical and Magnetic Materials
    • Condensed Matter Physics
    • Mechanical Engineering
    • Electrical and Electronic Engineering

    フィンガープリント Stress-free stretchable electronic device using folding deformation' の研究トピックを掘り下げます。これらはともに一意のフィンガープリントを構成します。

  • これを引用

    Iwata, Y., & Iwase, E. (2017). Stress-free stretchable electronic device using folding deformation. : 2017 IEEE 30th International Conference on Micro Electro Mechanical Systems, MEMS 2017 (pp. 231-234). [7863383] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/MEMSYS.2017.7863383