Structure-Thermal Property Relationships of Polysilsesquioxanes for Thermal Insulation Materials

Takashi Hamada*, Taku Goto, Sakino Takase, Kenta Okada, Akira Uedono, Joji Ohshita

*この研究の対応する著者

研究成果: Article査読

2 被引用数 (Scopus)

抄録

For the development of polysilsesquioxanes (PSQs) as organic-inorganic hybrid materials for efficient thermal insulators, gaining a better understanding on the structure-thermal property relationship of PSQ gel films is essential. With this aim, PSQs were prepared via the sol-gel method to investigate the influence of residual alkoxy groups and substituents on the thermal insulation property of PSQ freestanding gel films. The thermal diffusivities of gel films prepared from polymethylsilsesquioxanes having ethoxy and isobutoxy groups increased with increasing the amount of these residual groups. However, compared with the ethoxy group, the bulky isobutoxy group decreased the thermal diffusivity of the corresponding polymethylsilsesquioxanes gel films. The thermal insulation property of the PSQ films was affected by the amount of residual alkoxy groups mainly due to their bulkiness. The presence of a phenyl group bonded to the silicon atom apparently decreased the thermal diffusivity of a gel film prepared from polyphenylsilsesquioxane compared with that of a polymethylsilsesquioxane gel film. Meanwhile, the thermal stability of the polyphenylsilsesquioxane gel film was significantly higher than that of polymethylsilsesquioxane gel film. Overall, the organic substituents on the silicon atom affected the thermal insulation property and thermal stability of PSQ films.

本文言語English
ページ(範囲)2851-2859
ページ数9
ジャーナルACS Applied Polymer Materials
4
4
DOI
出版ステータスPublished - 2022 4月 8
外部発表はい

ASJC Scopus subject areas

  • ポリマーおよびプラスチック
  • プロセス化学およびプロセス工学
  • 有機化学

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