The void distribution measurements were performed to clarify the void behavior phenomena in rod bundle with non-uniform rod gap. X-ray computer topography scanner was applied for the void distribution measurement in the rod bundle. The test results reveal that the void concentrates on the wider subchannel due to void drift and the void distribution becomes flatter with increasing quality. The vapor velocity at the wide subchannel becomes larger and the slip ratio between vapor and liquid increases compared with uniform rod gap. Therefore, the average void fraction of the bundle with non-uniform rod gap is reduced.
|ジャーナル||Nippon Kikai Gakkai Ronbunshu, B Hen/Transactions of the Japan Society of Mechanical Engineers, Part B|
|出版ステータス||Published - 2003 1|
ASJC Scopus subject areas
- Mechanical Engineering