Study of Low-residual Stress Amorphous Film Deposition Method for LiTaO3/Quartz or LiNbO3/Quartz Bonding toward 5G Surface Acoustic Wave Devices

Ami Tezuka, Hiroyuki Kuwae, Kosuke Yamada, Shuichi Shoji, Shoji Kakio, Jun Mizuno

研究成果: Conference contribution

抄録

LiTaO3 (LT) or LiNbO3 (LN)/Quartz bonded substrates with an amorphous intermediate layer were proposed to achieve both a large surface acoustic wave (SAW) velocity and a smaller temperature coefficient of frequency. Residual stress reduction of the amorphous film is expected to improve the bonding strength of a SAW substrate. In this report, we studied a method of low-residual stress amorphous film deposition for LT or LN/Quartz bonding. The residual stress of the LT substrate with an amorphous SiO2 or Al2O3 film deposited by ion beam sputtering, electron cyclotron resonance sputtering, and atomic layer deposition was evaluated. The LT substrate with the amorphous Al2O3 film deposited by ALD had the minimum warpage (-0.152 μm) and residual stress (127.3 MPa). The residual stress of the Al2O3 film deposited by ALD might be reduced because almost the same thickness of the Al2O3 film was deposited on both sides of the LT substrate at the same time. The maximum bonding strength of 3.7 MPa was achieved in the substrate with the Al2O3 film deposited by ALD. From these results, LT or LN/Quartz substrates with the Al2O3 film deposited by ALD are promising materials to reduce residual stress toward SAW devices for 5G mobile communication.

本文言語English
ホスト出版物のタイトル2019 International Conference on Electronics Packaging, ICEP 2019
出版社Institute of Electrical and Electronics Engineers Inc.
ページ414-417
ページ数4
ISBN(電子版)9784990218867
DOI
出版ステータスPublished - 2019 4
イベント2019 International Conference on Electronics Packaging, ICEP 2019 - Niigata, Japan
継続期間: 2019 4 172019 4 20

出版物シリーズ

名前2019 International Conference on Electronics Packaging, ICEP 2019

Conference

Conference2019 International Conference on Electronics Packaging, ICEP 2019
国/地域Japan
CityNiigata
Period19/4/1719/4/20

ASJC Scopus subject areas

  • 電子工学および電気工学
  • 電子材料、光学材料、および磁性材料
  • 金属および合金

フィンガープリント

「Study of Low-residual Stress Amorphous Film Deposition Method for LiTaO<sub>3</sub>/Quartz or LiNbO<sub>3</sub>/Quartz Bonding toward 5G Surface Acoustic Wave Devices」の研究トピックを掘り下げます。これらがまとまってユニークなフィンガープリントを構成します。

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