Study of low-temperature wafer bonding with Au-Au bonding technique

H. Kurotaki, H. Shinohara, H. Kobayashi, J. Mizuno, S. Shoji

研究成果: Conference contribution

3 引用 (Scopus)
元の言語English
ホスト出版物のタイトル2008 Proceedings of the ASME - 2nd International Conference on Integration and Commercialization of Micro and Nanosystems, MicroNano 2008
ページ747-748
ページ数2
DOI
出版物ステータスPublished - 2008 12 1
イベント2008 ASME 2nd International Conference on Integration and Commercialization of Micro and Nanosystems, MicroNano 2008 - Kowloon, Hong Kong
継続期間: 2008 6 32008 6 5

出版物シリーズ

名前2008 Proceedings of the ASME - 2nd International Conference on Integration and Commercialization of Micro and Nanosystems, MicroNano 2008

Conference

Conference2008 ASME 2nd International Conference on Integration and Commercialization of Micro and Nanosystems, MicroNano 2008
Hong Kong
Kowloon
期間08/6/308/6/5

ASJC Scopus subject areas

  • Biotechnology
  • Electrical and Electronic Engineering

これを引用

Kurotaki, H., Shinohara, H., Kobayashi, H., Mizuno, J., & Shoji, S. (2008). Study of low-temperature wafer bonding with Au-Au bonding technique. : 2008 Proceedings of the ASME - 2nd International Conference on Integration and Commercialization of Micro and Nanosystems, MicroNano 2008 (pp. 747-748). (2008 Proceedings of the ASME - 2nd International Conference on Integration and Commercialization of Micro and Nanosystems, MicroNano 2008). https://doi.org/10.1115/MicroNano2008-70064