Study of low-temperature wafer bonding with Au-Au bonding technique

H. Kurotaki, H. Shinohara, H. Kobayashi, Jun Mizuno, Shuichi Shoji

研究成果: Conference contribution

3 引用 (Scopus)
元の言語English
ホスト出版物のタイトル2008 Proceedings of the ASME - 2nd International Conference on Integration and Commercialization of Micro and Nanosystems, MicroNano 2008
ページ747-748
ページ数2
DOI
出版物ステータスPublished - 2008
イベント2008 ASME 2nd International Conference on Integration and Commercialization of Micro and Nanosystems, MicroNano 2008 - Kowloon
継続期間: 2008 6 32008 6 5

Other

Other2008 ASME 2nd International Conference on Integration and Commercialization of Micro and Nanosystems, MicroNano 2008
Kowloon
期間08/6/308/6/5

Fingerprint

Wafer bonding
Temperature

ASJC Scopus subject areas

  • Biotechnology
  • Electrical and Electronic Engineering

これを引用

Kurotaki, H., Shinohara, H., Kobayashi, H., Mizuno, J., & Shoji, S. (2008). Study of low-temperature wafer bonding with Au-Au bonding technique. : 2008 Proceedings of the ASME - 2nd International Conference on Integration and Commercialization of Micro and Nanosystems, MicroNano 2008 (pp. 747-748) https://doi.org/10.1115/MicroNano2008-70064

Study of low-temperature wafer bonding with Au-Au bonding technique. / Kurotaki, H.; Shinohara, H.; Kobayashi, H.; Mizuno, Jun; Shoji, Shuichi.

2008 Proceedings of the ASME - 2nd International Conference on Integration and Commercialization of Micro and Nanosystems, MicroNano 2008. 2008. p. 747-748.

研究成果: Conference contribution

Kurotaki, H, Shinohara, H, Kobayashi, H, Mizuno, J & Shoji, S 2008, Study of low-temperature wafer bonding with Au-Au bonding technique. : 2008 Proceedings of the ASME - 2nd International Conference on Integration and Commercialization of Micro and Nanosystems, MicroNano 2008. pp. 747-748, 2008 ASME 2nd International Conference on Integration and Commercialization of Micro and Nanosystems, MicroNano 2008, Kowloon, 08/6/3. https://doi.org/10.1115/MicroNano2008-70064
Kurotaki H, Shinohara H, Kobayashi H, Mizuno J, Shoji S. Study of low-temperature wafer bonding with Au-Au bonding technique. : 2008 Proceedings of the ASME - 2nd International Conference on Integration and Commercialization of Micro and Nanosystems, MicroNano 2008. 2008. p. 747-748 https://doi.org/10.1115/MicroNano2008-70064
Kurotaki, H. ; Shinohara, H. ; Kobayashi, H. ; Mizuno, Jun ; Shoji, Shuichi. / Study of low-temperature wafer bonding with Au-Au bonding technique. 2008 Proceedings of the ASME - 2nd International Conference on Integration and Commercialization of Micro and Nanosystems, MicroNano 2008. 2008. pp. 747-748
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