We report the fabrication and evaluation of the Cu/Bi bilayer absorber with electrodeposition. We designed the Cu/Bi absorber to satisfy the requirements for scanning transmission electron microscope (STEM). The residual resistivity ratios of films of Cu and Bi with electrodeposition was 5.91 ± 0.49 and 2.06 ± 0.33 , respectively; these values are sufficient for the requirements of STEM. We found that the Cu/Bi bilayer absorber TES microcalorimeter experienced a pulse-shape variation and we considered that these variations were caused by the quality of the contact surface between the absorber and TES. In addition, we examined the structure of the absorber using focus ion beam analysis and STEM. The results suggest that an oxidation between the Cu and seed layer, in which the layer is an electrode for electrodeposition, yielded variations. Moreover, thermal simulation suggests that the thermal conduction between the absorber and TES caused variations. The results of this study will improve the process of Bi electrodeposition.
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