Study on void distribution of a rod bundle with a non-uniform rod gap

Miyuki Akiba, Shinichi Morooka, Kenetsu Shirakawa

研究成果: Conference contribution

抄録

Void distribution measurements were performed to clarify the void behaviour phenomena in a rod bundle with a nonuniform rod gap. An X-ray computed tomography scanner was applied for the void distribution measurement in the rod bundle. The test results show that the void concentrates on the wider subchannel due to void drift and the void distribution becomes flatter with increasing quality. The vapour velocity at the wide subchannel becomes larger and the slip ratio between vapour and liquid increases compared with a uniform rod gap. Therefore, the average void fraction of the bundle is reduced.

本文言語English
ホスト出版物のタイトル4th World Congress in Industrial Process Tomography
出版社International Society for Industrial Process Tomography
ページ273-278
ページ数6
ISBN(印刷版)9780853163206
出版ステータスPublished - 2005
外部発表はい
イベント4th World Congress in Industrial Process Tomography - Aizu
継続期間: 2005 9 52005 9 5

Other

Other4th World Congress in Industrial Process Tomography
CityAizu
Period05/9/505/9/5

ASJC Scopus subject areas

  • Control and Systems Engineering
  • Computational Mechanics
  • Computer Vision and Pattern Recognition
  • Computer Science Applications

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