Substrate (Ni)-catalyzed electroless gold deposition from a noncyanide bath containing thiosulfate and sulfite I. Reaction mechanism

M. Kato, J. Sato, H. Otani, T. Homma, Y. Okinaka, T. Osaka*, O. Yoshioka

*この研究の対応する著者

研究成果: Article査読

40 被引用数 (Scopus)

抄録

Electroless gold deposition is known to take place on Ni-based substrates even when the conventional reducing agent is excluded from the autocatalytic bath containing thiosulfate and sulfite as ligands for gold ions. It is shown in this paper that the reaction of gold deposition from this bath on electroless Ni-B substrate is not autocatalytic but, instead, proceeds primarily by the mechanism of substrate catalysis with galvanic displacement playing a secondary role. It was established that sulfite serves as the reducing agent for the substrate-catalyzed gold deposition reaction.

本文言語English
ページ(範囲)C164-C167
ジャーナルJournal of the Electrochemical Society
149
3
DOI
出版ステータスPublished - 2002 3 1

ASJC Scopus subject areas

  • 電子材料、光学材料、および磁性材料
  • 再生可能エネルギー、持続可能性、環境
  • 表面、皮膜および薄膜
  • 電気化学
  • 材料化学

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