Substrate (Ni)-catalyzed electroless gold deposition from a noncyanide bath containing thiosulfate and sulfite I. Reaction mechanism

M. Kato, J. Sato, H. Otani, Takayuki Homma, Y. Okinaka, Tetsuya Osaka, O. Yoshioka

研究成果: Article

38 引用 (Scopus)

抄録

Electroless gold deposition is known to take place on Ni-based substrates even when the conventional reducing agent is excluded from the autocatalytic bath containing thiosulfate and sulfite as ligands for gold ions. It is shown in this paper that the reaction of gold deposition from this bath on electroless Ni-B substrate is not autocatalytic but, instead, proceeds primarily by the mechanism of substrate catalysis with galvanic displacement playing a secondary role. It was established that sulfite serves as the reducing agent for the substrate-catalyzed gold deposition reaction.

元の言語English
ジャーナルJournal of the Electrochemical Society
149
発行部数3
DOI
出版物ステータスPublished - 2002 3

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Thiosulfates
sulfites
Sulfites
Gold
baths
gold
Reducing Agents
Reducing agents
Substrates
Catalysis
catalysis
Ligands
Ions
ligands
ions

ASJC Scopus subject areas

  • Electrochemistry
  • Surfaces, Coatings and Films
  • Surfaces and Interfaces

これを引用

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AU - Kato, M.

AU - Sato, J.

AU - Otani, H.

AU - Homma, Takayuki

AU - Okinaka, Y.

AU - Osaka, Tetsuya

AU - Yoshioka, O.

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AB - Electroless gold deposition is known to take place on Ni-based substrates even when the conventional reducing agent is excluded from the autocatalytic bath containing thiosulfate and sulfite as ligands for gold ions. It is shown in this paper that the reaction of gold deposition from this bath on electroless Ni-B substrate is not autocatalytic but, instead, proceeds primarily by the mechanism of substrate catalysis with galvanic displacement playing a secondary role. It was established that sulfite serves as the reducing agent for the substrate-catalyzed gold deposition reaction.

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