Surface Activated Bonding Method for Low Temperature Bonding

Tadatomo Suga, Fengwen Mu

研究成果: Conference contribution

2 被引用数 (Scopus)

抄録

The surface activated bonding (SAB) method for low temperature bonding: its development for heterogeneous and 3D integration is reviewed. The standard SAB method is based on surface bombardment by Ar beam in ultra-high vacuum to clean the surfaces so that they can be bonded very strongly at room temperature without heat treatment. Modifications of the surface activation have been investigated to extend the standard SAB method for various materials and applications.

本文言語English
ホスト出版物のタイトル2018 7th Electronic System-Integration Technology Conference, ESTC 2018 - Proceedings
出版社Institute of Electrical and Electronics Engineers Inc.
ISBN(電子版)9781538668139
DOI
出版ステータスPublished - 2018 11 26
外部発表はい
イベント7th Electronic System-Integration Technology Conference, ESTC 2018 - Dresden, Germany
継続期間: 2018 9 182018 9 21

出版物シリーズ

名前2018 7th Electronic System-Integration Technology Conference, ESTC 2018 - Proceedings

Other

Other7th Electronic System-Integration Technology Conference, ESTC 2018
CountryGermany
CityDresden
Period18/9/1818/9/21

ASJC Scopus subject areas

  • Hardware and Architecture
  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials

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