Surface compliant bonding properties of low-temperature wafer bonding using sub-micron Au particles

Hiroyuki Ishida, Toshinori Ogashiwa, Yukio Kanehira, Hiroshi Murai, Takuya Yazaki, Shin Ito, Jun Mizuno

研究成果

6 被引用数 (Scopus)

抄録

Compression deformation property, which is directly related to an ability of surface compliant bonding and hermetic sealing, of low-temperature wafer bonding using sub-micron Au particles was studied. Wafer bonding test using 0.3 μm particles demonstrated excellent hermeticity with He leak rate better than 1 × 10-9 Pa·m3/s even on a substrate with a surface topography of a few μm. Cross-section SEM observation of the patterns with different particle sizes demonstrated that special voids are smaller in 0.1 μm particle patterns compared to that in 0.3 μm particle patterns. Deformation measurement revealed that 0.1μm particle patterns with initial height of 17 μm deformed by 9.4 μm after pressed at 100 MPa, which is fairly larger than that of 6.2 μm for 0.3 μm Au particles. This result can indicate that patterns with smaller size Au particles can be hermetically bonded at lower applied pressure.

本文言語English
ホスト出版物のタイトル2013 IEEE 63rd Electronic Components and Technology Conference, ECTC 2013
ページ1519-1523
ページ数5
DOI
出版ステータスPublished - 2013 9 9
イベント2013 IEEE 63rd Electronic Components and Technology Conference, ECTC 2013 - Las Vegas, NV, United States
継続期間: 2013 5 282013 5 31

出版物シリーズ

名前Proceedings - Electronic Components and Technology Conference
ISSN(印刷版)0569-5503

Conference

Conference2013 IEEE 63rd Electronic Components and Technology Conference, ECTC 2013
国/地域United States
CityLas Vegas, NV
Period13/5/2813/5/31

ASJC Scopus subject areas

  • 電子材料、光学材料、および磁性材料
  • 電子工学および電気工学

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