We found that surface protrusions of chemical vapor deposited TiN films are caused by reactions between copper contaminants and the silicon substrate. Depending on the size of the copper contaminant, two kinds of defects were formed: copper silicide (CuSi) and silicon dioxide. The silicon dioxide is formed because of the catalytic role of copper silicide. The defects grow both into and out of the silicon substrate. In the formation of copper silicide and silicon dioxide, copper, silicon, and oxygen are the major participating species.
|ジャーナル||Japanese Journal of Applied Physics, Part 2: Letters|
|出版ステータス||Published - 1998|
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