Temperature-controlled transfer and self-wiring for multi-color led display on a flexible substrate

Eiji Iwase*, Hiroaki Onoe, Akihito Nakai, Kiyoshi Matsumoto, Isao Shimoyama

*この研究の対応する著者

研究成果: Conference contribution

2 被引用数 (Scopus)

抄録

We propose an integration method for arranging LED bare chips on a flexible substrate to fabricate a multi-color LED display. LED chips (240 μm × 240 μm × 75 μm) which were arrayed on an adhesive sheet were transferred to a flexible circuit substrate using our temperature-controlled transfer (TCT) and self-wiring (SW) method. Using these methods, we demonstrated a 5-by-5 LED flexible device and a two-color (blue and green) LED device, and observed light emission from the LED chips.

本文言語English
ホスト出版物のタイトル22nd IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2009
出版社Institute of Electrical and Electronics Engineers Inc.
ページ176-179
ページ数4
ISBN(印刷版)9781424429776
DOI
出版ステータスPublished - 2009 1月 1
外部発表はい
イベント22nd IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2009 - Sorrento, Italy
継続期間: 2009 1月 252009 1月 29

出版物シリーズ

名前Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
ISSN(印刷版)1084-6999

Other

Other22nd IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2009
国/地域Italy
CitySorrento
Period09/1/2509/1/29

ASJC Scopus subject areas

  • 電子材料、光学材料、および磁性材料
  • 凝縮系物理学
  • 機械工学
  • 電子工学および電気工学

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