Terahertz spectroscopy as a new tool for insulating material analysis and condition monitoring

Norikazu Fuse, Tsuguhiro Takahashi, Yoshimichi Ohki, Ryo Sato, Maya Mizuno, Kaori Fukunaga

    研究成果: Article

    46 引用 (Scopus)

    抄録

    New nondestructive internal condition monitoring methods using terahertz waves are reviewed. The experimental spectra are sensitive to material morphology and originate from dielectric resonance responses. Numerical simulation based on density functional theory visualizes the resonance modes.

    元の言語English
    記事番号5871366
    ページ（範囲）26-35
    ページ数10
    ジャーナルIEEE Electrical Insulation Magazine
    巻27
    発行部数3
    DOI
    出版物ステータスPublished - 2011 5

    Fingerprint

    Terahertz spectroscopy
    Insulating materials
    Condition monitoring
    Terahertz waves
    Density functional theory
    Computer simulation

    ASJC Scopus subject areas

    • Electrical and Electronic Engineering
    • Electronic, Optical and Magnetic Materials

    これを引用

    Terahertz spectroscopy as a new tool for insulating material analysis and condition monitoring. / Fuse, Norikazu; Takahashi, Tsuguhiro; Ohki, Yoshimichi; Sato, Ryo; Mizuno, Maya; Fukunaga, Kaori.

    ：: IEEE Electrical Insulation Magazine, 巻 27, 番号 3, 5871366, 05.2011, p. 26-35.

    研究成果: Article

    Fuse, N, Takahashi, T, Ohki, Y, Sato, R, Mizuno, M & Fukunaga, K 2011, 'Terahertz spectroscopy as a new tool for insulating material analysis and condition monitoring', IEEE Electrical Insulation Magazine, 巻. 27, 番号 3, 5871366, pp. 26-35. https://doi.org/10.1109/MEI.2011.5871366
    Fuse N, Takahashi T, Ohki Y, Sato R, Mizuno M, Fukunaga K. Terahertz spectroscopy as a new tool for insulating material analysis and condition monitoring. IEEE Electrical Insulation Magazine. 2011 5;27(3):26-35. 5871366. https://doi.org/10.1109/MEI.2011.5871366
    Fuse, Norikazu ; Takahashi, Tsuguhiro ; Ohki, Yoshimichi ; Sato, Ryo ; Mizuno, Maya ; Fukunaga, Kaori. / Terahertz spectroscopy as a new tool for insulating material analysis and condition monitoring. ：: IEEE Electrical Insulation Magazine. 2011 ; 巻 27, 番号 3. pp. 26-35.
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