The effect of solid-state nanoporous Cu bonding for power device

Byungho Park, Duy le Han, Mikiko Saito, Jun Mizuno, Hiroshi Nishikawa

研究成果: Conference contribution

抄録

Recently, the sintered nanoparticle has received an attention as a replacement for high temperature lead-based solder in the electronic device packaging due to its great thermal conductivity, mechanical properties and high melting temperature. However, there are still some problems such as controlling the thickness and the formation of unexpected voids caused by evaporation of solvent. In this study, nanoporous Cu (NPC) bonding process was developed to achieve a Cu-Cu bonding without solvent and flux. NPC sheet was fabricated by dealloying from cold-rolled Mn-Cu precursor. The effect of bonding temperatures (200–400 °C), pressure (2.5–20 MPa), and atmospheres (N2 and formic acid) on the joint strength of NPC bonding was investigated. The bonding mechanism was investigated by fracture surface of NPC bonding, as well as cross-sectional sample. These results revealed that the NPC bonding was closely related with the oxide layer formed on the NPC surface due to the interruption of diffusion between NPC and substrate.

本文言語English
ホスト出版物のタイトル2021 International Conference on Electronics Packaging, ICEP 2021
出版社Institute of Electrical and Electronics Engineers Inc.
ページ159-160
ページ数2
ISBN(電子版)9784991191114
DOI
出版ステータスPublished - 2021 5 12
イベント20th International Conference on Electronics Packaging, ICEP 2021 - Tokyo, Japan
継続期間: 2021 5 122021 5 14

出版物シリーズ

名前2021 International Conference on Electronics Packaging, ICEP 2021

Conference

Conference20th International Conference on Electronics Packaging, ICEP 2021
国/地域Japan
CityTokyo
Period21/5/1221/5/14

ASJC Scopus subject areas

  • 電子工学および電気工学
  • 材料力学
  • 電子材料、光学材料、および磁性材料
  • 器械工学

フィンガープリント

「The effect of solid-state nanoporous Cu bonding for power device」の研究トピックを掘り下げます。これらがまとまってユニークなフィンガープリントを構成します。

引用スタイル