Thermal-Aware floorplanning for noc-sprinting

Due to the rise of utilization wall, a large portion of silicon chips become dark or dim silicon. A NoC-sprinting method is proposed to deal with this problem for instantaneous improvement and the key design constraint of these problems is thermal design power(TDP). In this work we propose a thermalaware Modified Insert After Remove Floorplanning(MD-IARFP) algorithm for NoC-sprinting. Wire length is taken into consideration while only thermal behavior is concerned in the previous work. A thermal model is constructed to evaluate temperature, using relationship between heat transfer and electrical phenomena. Simulated Annealing(SA) based MD-IARFP algorithm is applied to optimize the distribution of active cores. In terms of perturbation of SA, Modified Insert After Remove(MD-IAR) method gives an efficient generation of new floorplan which helps to reduce iterate number and lead to less CPU time. Effective as the experimental results show, our proposal provides better solution with lower temperature and significant decrease of wire length.