Thermal characteristic evaluation and transient thermal analysis of next-generation sic power module at 250 °C

Akihiro Imakiire, Masahiro Kozako, Masayuki Hikta, Kohei Tatsumi, Masakazu Inagaki, Tomonori Iizuka, Hiroaki Narimatsu, Nobuaki Sato, Koji Shimizu, Kazutoshi Ueda, Kazuhiko Sugiura, Kazuhiro Tsuruta, Makio Iida, Keiji Toda

研究成果: Conference contribution

4 被引用数 (Scopus)

抄録

In recent years, the demand for the operation of SiC power modules under high temperatures has emerged. The authors have so far investigated prototype SiC power modules using Ni micro plating bonding [NMPB] for junction temperatures driven at 250 °C. This paper presents the thermal characteristics and transient thermal analysis of a prototype novel SiC power module using NMPB, and compares with those of the conventional structure power module using high-temperature solder. Furthermore, we attempt to estimate and analyze the thermal resistance in a power module using a structure function derived from transient thermal analysis to discuss the delamination or void formation caused by a power cycling test.

本文言語English
ホスト出版物のタイトルCIPS 2018 - 10th International Conference on Integrated Power Electronics Systems
出版社VDE VERLAG GMBH
ページ174-179
ページ数6
ISBN(電子版)9783800745401
出版ステータスPublished - 2018
イベント10th International Conference on Integrated Power Electronics Systems, CIPS 2018 - Stuttgart, Germany
継続期間: 2018 3 202018 3 22

出版物シリーズ

名前CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems

Conference

Conference10th International Conference on Integrated Power Electronics Systems, CIPS 2018
国/地域Germany
CityStuttgart
Period18/3/2018/3/22

ASJC Scopus subject areas

  • 電子工学および電気工学
  • エネルギー工学および電力技術

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