TY - JOUR
T1 - Thermal fatigue properties and grain boundary character distribution in Sn-xAg-o.5Cu (x=1, 1.2 and 3) lead free solder interconnects
AU - Terashima, S.
AU - Tanaka, M.
AU - Tatsumi, K.
PY - 2008/1/1
Y1 - 2008/1/1
N2 - Thermal fatigue properties of Sn-xAg-0.5Cu (x=1, 1-2 and 3, mass%) lead free solder interconnects were discussed from the viewpoints of both morphology and grain boundary character distribution. 3Ag showed the longer thermal fatigue life than 1Ag and 1.2Ag. Both cracks, which were initiated by thermal strain, and grain boundary damage due to grain boundary sliding degraded the thermal fatigue lives. From a microstructural observation using orientation imaging microscopy, recrystalllsation of tin grains was observed, and 3Ag suppressed coarsening of tin grains after further thermal fatigue as compared with 1Ag and 1.2Ag. Moreover, 3Ag showed a larger amount of coincidence site lattice boundaries than 1Ag and 1.2Ag. It is suggested that in 3Ag not only smaller tin grains but also larger amount of coincidence site lattice boundaries suppressed crack propagation and grain boundary sliding.
AB - Thermal fatigue properties of Sn-xAg-0.5Cu (x=1, 1-2 and 3, mass%) lead free solder interconnects were discussed from the viewpoints of both morphology and grain boundary character distribution. 3Ag showed the longer thermal fatigue life than 1Ag and 1.2Ag. Both cracks, which were initiated by thermal strain, and grain boundary damage due to grain boundary sliding degraded the thermal fatigue lives. From a microstructural observation using orientation imaging microscopy, recrystalllsation of tin grains was observed, and 3Ag suppressed coarsening of tin grains after further thermal fatigue as compared with 1Ag and 1.2Ag. Moreover, 3Ag showed a larger amount of coincidence site lattice boundaries than 1Ag and 1.2Ag. It is suggested that in 3Ag not only smaller tin grains but also larger amount of coincidence site lattice boundaries suppressed crack propagation and grain boundary sliding.
KW - Grain boundary character distribution
KW - Lead free solder
KW - Orientation imaging microscopy
KW - Sn-Ag-Cu
KW - Thermal fatigue
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U2 - 10.1179/174329308X271788
DO - 10.1179/174329308X271788
M3 - Article
AN - SCOPUS:43249090649
VL - 13
SP - 60
EP - 65
JO - Science and Technology of Welding and Joining
JF - Science and Technology of Welding and Joining
SN - 1362-1718
IS - 1
ER -