Thermal fatigue properties and grain boundary character distribution of lead-free Sn-1.2Ag-0.5Cu solder interconnects on WLP

Engineering & Materials Science

• Thermal fatigue 71%
• Grain boundaries 58%
• Soldering alloys 57%
• Lead 54%
• Tin 34%
• Grain boundary sliding 21%
• Fatigue of materials 20%
• Lead-free solders 18%
• Coarsening 17%
• Silver 15%
• Microscopic examination 15%
• Hot Temperature 14%
• Crack propagation 12%
• Imaging techniques 11%
• Cracks 9%
• Chemical analysis 9%

Chemical Compounds

• Thermal Fatigue 100%
• Solder 72%
• Grain Boundary 60%
• Drop 25%
• Crack Propagation 20%
• Strain 20%
• Amount 12%