Thermal fatigue properties and grain boundary character distribution of lead-free Sn-1.2Ag-0.5Cu solder interconnects on WLP
Shinichi Terashima, Takayuki Kobayashi, Shinji Ishikawa, Tsutomu Sasaki, Kohei Tatsumi, Masamoto Tanakaupu
研究成果: Paper › 査読
Shinichi Terashima, Takayuki Kobayashi, Shinji Ishikawa, Tsutomu Sasaki, Kohei Tatsumi, Masamoto Tanakaupu
研究成果: Paper › 査読