Thermal reliability of gold - aluminum bonds encapsulated in bi-phenyl epoxy resin

Tomohiro Uno*, Kohei Tatsumi

*この研究の対応する著者

研究成果査読

47 被引用数 (Scopus)

抄録

Bond degradation of Au wire/A1 pad has become a major problem, because of the use of molding resin with low thermal stability (e.g. bi-phenyl epoxy resin) and the use of the IC devices under high thermal environments. It is therefore important to insure the thermal reliability at Au/Al bonds. The lifetime to bond failure of bi-phenyl epoxy molding became shorter than that for cresol novolac epoxy. The failures were caused by the corrosion reaction of Au-Al intermetallics with bromine (Br) contained in the resin compounds. It was clarified that the reactive intermetallic was Au4Al phase formed in the bond interface. The governing factors of the bond corrosion were investigated such as resin compound and gold wire material. Especially some impurities in gold wire could affect the Au-Al intermetallic growing and therefore retard the corrosion. The use of the alloyed wire was effective in improving the bond reliability.

本文言語English
ページ(範囲)145-153
ページ数9
ジャーナルMicroelectronics Reliability
40
1
DOI
出版ステータスPublished - 2000 1 14
外部発表はい

ASJC Scopus subject areas

  • 電子材料、光学材料、および磁性材料
  • 原子分子物理学および光学
  • 安全性、リスク、信頼性、品質管理
  • 凝縮系物理学
  • 表面、皮膜および薄膜
  • 電子工学および電気工学

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