Thermal resistance and transient thermal analysis of sic power module using ni micro plating bonding

Akihiro Imakiire, Masahiro Kozako, Masayuki Hikita, Kohei Tatsumi, Masakazu Inagaki, Tomonori Iizuka, Nobuaki Sato, Koji Shimizu, Kazutoshi Ueda, Kazuhiko Sugiura, Kazuhiro Tsuruta, Keiji Toda

研究成果査読

抄録

This paper deals with the thermal resistance and thermal conduction characteristics of a Nickel Micro Plating Bonding (NMPB) power module in comparison with those of a power module adapting a conventional structure with a high-temperature solder attachment. An attempt is made to estimate the thermal resistance and thermal structure function for the two types of power modules when peeling of the chip junction occurs. In terms of spreading heat, an NMPB is superior to a conventional power module using high temperature solder, because NMPB allows spreading heat from both sides of the chip and setting the heat spreader near the chip.

本文言語English
ページ(範囲)838-846
ページ数9
ジャーナルieej transactions on industry applications
139
10
DOI
出版ステータスPublished - 2019

ASJC Scopus subject areas

  • 産業および生産工学
  • 電子工学および電気工学

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