Thermal resistance and transient thermal analysis of sic power module using ni micro plating bonding

Akihiro Imakiire, Masahiro Kozako, Masayuki Hikita, Kohei Tatsumi, Masakazu Inagaki, Tomonori Iizuka, Nobuaki Sato, Koji Shimizu, Kazutoshi Ueda, Kazuhiko Sugiura, Kazuhiro Tsuruta, Keiji Toda