Thermomechanical reliability analysis and optimization for MEMS packages with AuSn solder

Rui Zhang, Hongbin Shi, Toshitsugu Ueda, Jiong Zhang, Yuehong Dai

    研究成果: Conference contribution

    3 被引用数 (Scopus)

    抄録

    Thermal stress formed in the solder of the microelectromechanical systems (MEMS) sensor during the reflow soldering process due to the coefficients of thermal expansion (CTE) mismatch between the different materials. As the package needs to be hermetically sealed to protect the device from outside environmental effects, the local stress concentration would eventually cause cracks in the solder and influence the hermeticity. In this study, we present the thermo-mechanical analysis of the AuSn90 solder with low temperature co-fired ceramic (LTCC) package using Comsol Multiphysics. Thermal residual stress distribution in the solder after the reflow soldering process was simulated. According to the result, the maximum von Mises stress was found and several possible ways for minimizing the stress in the solder and improving the thermo-mechanical reliability were discussed.

    本文言語English
    ホスト出版物のタイトルProceedings of 2012 International Conference on Quality, Reliability, Risk, Maintenance, and Safety Engineering, ICQR2MSE 2012
    ページ794-797
    ページ数4
    DOI
    出版ステータスPublished - 2012
    イベント2012 International Conference on Quality, Reliability, Risk, Maintenance, and Safety Engineering, ICQR2MSE 2012 - Chengdu
    継続期間: 2012 6 152012 6 18

    Other

    Other2012 International Conference on Quality, Reliability, Risk, Maintenance, and Safety Engineering, ICQR2MSE 2012
    CityChengdu
    Period12/6/1512/6/18

    ASJC Scopus subject areas

    • 安全性、リスク、信頼性、品質管理

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