TY - JOUR
T1 - Three-dimensional microfabrication process using Bi electrodeposition for a highly sensitive X-ray imaging sensor
AU - Sato, Hirotaka
AU - Homma, Takayuki
AU - Kudo, Hiroyuki
AU - Izumi, Toshimitsu
AU - Osaka, Tetsuya
AU - Shoji, Shuichi
N1 - Funding Information:
The authors would like to thank Dr. Y. Ishisaki, Tokyo Metropolitan University, Dr. R. Fujimoto, and Prof. K. Mitsuda, Japan Aerospace Exploration Agency, for valuable discussions. They also wish to thank Mr. H. Kobayashi for his experimental help. This work was supported financially in part by a Research Grant from the Shorai-Foundation and was performed at the 21st Century Center of Excellence (COE) under the Program “Practical Nano-Chemistry” from The Ministry of Education, Culture, Sports, Science and Technology, Japan.
PY - 2005/10/1
Y1 - 2005/10/1
N2 - A microscale Bi electrodeposition process was developed and applied to the three-dimensional fabrication of a highly sensitive X-ray imaging sensor, so called X-ray microcalorimeter, which has an array of sensing elements with a mushroom-shaped X-ray absorber. The composition and operating conditions for Bi electrodeposition were optimized and flat, smooth Bi deposits were obtained by applying additives such as diethylenetriamine pentaacetic acid (DTPA) and sodium n-dodecyl sulfate (SDS). The results of ultraviolet (UV)-visible absorption spectroscopy and polarization curves from the Bi electrodeposition solution indicated that the formation of a DTPA-Bi(III) complex and an increase of overpotential for Bi electrodeposition in the presence of SDS improved the solution stability as well as the surface morphology of the deposited film. The mold for the mushroom-shaped microstructure array was formed from a single-layered photoresist coating by applying sequential exposure steps for the "stem" part and the "roof" part. The absorber array was successfully fabricated by the Bi electrodeposition into the mold, precise polishing, and mold removal processes.
AB - A microscale Bi electrodeposition process was developed and applied to the three-dimensional fabrication of a highly sensitive X-ray imaging sensor, so called X-ray microcalorimeter, which has an array of sensing elements with a mushroom-shaped X-ray absorber. The composition and operating conditions for Bi electrodeposition were optimized and flat, smooth Bi deposits were obtained by applying additives such as diethylenetriamine pentaacetic acid (DTPA) and sodium n-dodecyl sulfate (SDS). The results of ultraviolet (UV)-visible absorption spectroscopy and polarization curves from the Bi electrodeposition solution indicated that the formation of a DTPA-Bi(III) complex and an increase of overpotential for Bi electrodeposition in the presence of SDS improved the solution stability as well as the surface morphology of the deposited film. The mold for the mushroom-shaped microstructure array was formed from a single-layered photoresist coating by applying sequential exposure steps for the "stem" part and the "roof" part. The absorber array was successfully fabricated by the Bi electrodeposition into the mold, precise polishing, and mold removal processes.
KW - Bismuth electrodeposition
KW - Microfabrication
KW - Micromachining
KW - Through mask plating
KW - X-ray imaging sensor
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U2 - 10.1016/j.jelechem.2004.11.001
DO - 10.1016/j.jelechem.2004.11.001
M3 - Article
AN - SCOPUS:25444479749
SN - 0022-0728
VL - 584
SP - 28
EP - 33
JO - Journal of Electroanalytical Chemistry
JF - Journal of Electroanalytical Chemistry
IS - 1
ER -