Recently, no-insulation (NI) winding techniques have been proposed for achieving high current density and high thermal stability. To verify the excellent characteristics achieved using these techniques, we investigated the transient behaviors of NI REBCO pancake coils. In this paper, we evaluate transient electromagnetic and thermal behaviors during a local normal-state transition, based on a partial element equivalent circuit and thermal coupled numerical analysis. Moreover, we investigate temporal and spatial current distributions in the NI coil winding after a local normal transition occurs. We also clarify the reason for the suppression of temperature increase caused by the local normal-state transition in the NI winding. Subsequently, we evaluate the influence of the thickness of a Cu stabilizer on the thermal stability of the NI and conventional insulation windings. Finally, we discuss the mechanism of high thermal stability attained in the NI coil winding technique.
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