Transmission electron microscopy study of electroless nip and cu films at initial deposition stage

T. Homma, K. Naito, M. Takai, T. Osaka, Y. Yamozaki, T. Namikawa

研究成果: Article査読

39 被引用数 (Scopus)

抄録

Microstructures of electroless NiP and Cu films at the initial deposition stages, deposited onto dielectric substrates, were examined by transmission electron microscopy. The difference in the initial deposition conditions between NiP and Cu films was clearly observed; it is suggested that their growth processes depended mainly on the initial crystalline states. The NiP deposits consist of very fine component crystallites that grow isotropically to form uniform and spherical grains. On the other hand, the Cu deposits are composed of larger component crystallites. They grow along their crystalline axes with random orientation, resulting in their angular and irregular deposition conditions.

本文言語English
ページ(範囲)1269-1274
ページ数6
ジャーナルJournal of the Electrochemical Society
138
5
DOI
出版ステータスPublished - 1991 5

ASJC Scopus subject areas

  • 電子材料、光学材料、および磁性材料
  • 再生可能エネルギー、持続可能性、環境
  • 表面、皮膜および薄膜
  • 電気化学
  • 材料化学

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