Transmission electron microscopy study of electroless NiP and Cu films at initial deposition stage

Takayuki Homma, K. Naito, M. Takai, Tetsuya Osaka, Y. Yamazaki, T. Namikawa

研究成果: Article

39 引用 (Scopus)

抄録

Microstructures of electroless NiP and Cu films at the initial deposition stages, deposited onto dielectric substrates, were examined by transmission electron microscopy. The difference in the initial deposition conditions between NiP and Cu films was clearly observed; it is suggested that their growth processes depended mainly on the initial crystalline states. The NiP deposits consist of very fine component crystallites that grow isotropically to form uniform and spherical grains. On the other hand, the Cu deposits are composed of larger component crystallites. They grow along their crystalline axes with random orientation, resulting in their angular and irregular deposition conditions.

元の言語English
ページ(範囲)1269-1274
ページ数6
ジャーナルJournal of the Electrochemical Society
138
発行部数5
出版物ステータスPublished - 1991 5

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Transmission electron microscopy
Crystallites
transmission electron microscopy
crystallites
Deposits
deposits
Crystalline materials
Crystal orientation
microstructure
Microstructure
Substrates

ASJC Scopus subject areas

  • Electrochemistry
  • Surfaces, Coatings and Films
  • Surfaces and Interfaces

これを引用

Transmission electron microscopy study of electroless NiP and Cu films at initial deposition stage. / Homma, Takayuki; Naito, K.; Takai, M.; Osaka, Tetsuya; Yamazaki, Y.; Namikawa, T.

:: Journal of the Electrochemical Society, 巻 138, 番号 5, 05.1991, p. 1269-1274.

研究成果: Article

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AU - Namikawa, T.

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