TSV Assignment of Thermal and Wirelength Optimization for 3D-IC Routing

Yi Zhao, Cong Hao, Takeshi Yoshimura

研究成果: Conference contribution

2 被引用数 (Scopus)

抄録

The 3D integrated circuit is a complex structure composed of chips in multi-layers fabricated vertically and horizontally. Signal through-silicon-via (TSV) is vertical electric connection enabling to communicate and compact the functional bulk. And thermal TSV is effective to amplify the heat dissipation and reduce temperature by establishing the heat dissipation path. In this work we introduce conditional grid extension method to Integrated Multi-Commodity Min-Cost (IMCMC) problem to relieve capacity limit. Moreover, we propose thermal increase model to simulate thermal distribution and realize temperature reduction. Compared with previous work, several routing revision is adopted to make the result more accurate and reduce wire capacitance. The experimental results show the effectiveness of our algorithm on reducing temperature and optimizing congestion.

本文言語English
ホスト出版物のタイトル2018 IEEE 28th International Symposium on Power and Timing Modeling, Optimization and Simulation, PATMOS 2018
出版社Institute of Electrical and Electronics Engineers Inc.
ページ155-162
ページ数8
ISBN(印刷版)9781538663653
DOI
出版ステータスPublished - 2018 9 12
イベント28th IEEE International Symposium on Power and Timing Modeling, Optimization and Simulation, PATMOS 2018 - Platja d'Aro, Spain
継続期間: 2018 7 22018 7 4

Other

Other28th IEEE International Symposium on Power and Timing Modeling, Optimization and Simulation, PATMOS 2018
CountrySpain
CityPlatja d'Aro
Period18/7/218/7/4

ASJC Scopus subject areas

  • Control and Optimization
  • Energy Engineering and Power Technology
  • Electrical and Electronic Engineering
  • Modelling and Simulation

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