Two methods for improving electrochemical migration resistance of printed wiring boards

Y. Ohki, Y. Hirose, G. Wada, H. Asakawa, T. Tanaka, T. Maeno, K. Okamoto

研究成果: Conference contribution

3 被引用数 (Scopus)

抄録

Experiments were carried out using space charge distribution measurements as a major measurement method in order to find effective measures to suppress electrochemical migration (ECM) along the thickness direction of a printed wiring board (PWB). As a result, the following valuable knowledge was obtained. First, in a PWB consisting of paper/ phenol-resin composite and a copper electrode, the electrical resistivity of epoxy resin used as an adhesive layer to connect the composite and the electrode is usually higher than that of the composite. In such a case, ECM is easily grown in the PWB. The resistance against ECM was found to increase significantly if we use an adhesive layer with a similar electrical resistivity to the insulating material in a PWB. Another important fact is that the growth of ECM can be suppressed if silica nanofillers were added to epoxy resin in the case of an epoxy-based PWB.

本文言語English
ホスト出版物のタイトルICHVE 2012 - 2012 International Conference on High Voltage Engineering and Application
ページ548-552
ページ数5
DOI
出版ステータスPublished - 2012 12 31
イベント2012 International Conference on High Voltage Engineering and Application, ICHVE 2012 - Shanghai, China
継続期間: 2012 9 172012 9 20

出版物シリーズ

名前ICHVE 2012 - 2012 International Conference on High Voltage Engineering and Application

Conference

Conference2012 International Conference on High Voltage Engineering and Application, ICHVE 2012
CountryChina
CityShanghai
Period12/9/1712/9/20

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

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