Underpotential deposition of aluminum and alloy formation on polycrystalline gold electrodes from AlCl3/EMIC room-temperature molten salts

Jae Joon Lee, In Tae Bae, Daniel Alberto Scherson, Barry Miller, Kraig A. Wheeler

研究成果: Article査読

56 被引用数 (Scopus)

抄録

Interfacial processes occurring at polycrystalline gold in acidic 1-ethyl-3-methylimidazolium chloroaluminate melts at room temperature, at potentials more positive than aluminium bulk deposition, include both Al underpotential deposition and the formation of Al/Au alloys. This information complements that reported in the literature for Al electrodeposition on Au in AlCl3/NaCl melts at temperatures of 200°C and higher. Cyclic voltammetry and chronopotentiometry suggest that at least two alloys form, and there is fast phase transformation between these intermetallic compounds at room temperature in the aluminum underpotential region. This transformation with thin gold films was slower than that in bulk gold electrodes.

本文言語English
ページ(範囲)562-566
ページ数5
ジャーナルJournal of the Electrochemical Society
147
2
DOI
出版ステータスPublished - 2000 2 1
外部発表はい

ASJC Scopus subject areas

  • 電子材料、光学材料、および磁性材料
  • 再生可能エネルギー、持続可能性、環境
  • 表面、皮膜および薄膜
  • 電気化学
  • 材料化学

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