Using nano-porous Au-Ag sheets as a joint layer for low-temperature Au-Au bonding

Hayata Mimatsu, Jun Mizuno*, Takashi Kasahara, Mikiko Saito, Hiroshi Nishikawa, Shuichi Shoji

*この研究の対応する著者

研究成果: Conference contribution

2 被引用数 (Scopus)

抄録

In this research, we proposed low-temperature Au-Au bonding using nano-porous Au-Ag sheets as a joint layer. The influences of annealing temperature on the porous structure and chemical properties of the sheets were investigated. The nano-porous sheet was fabricated by dealloying a 100μm thick Au-Ag sheet in solution HNO3. The nano-porous sheets were annealed between 100°C and 250°C. The chemical composition of the sheet was analyzed by using X-ray photoelectron spectroscopy (XPS). Two substrates and nano-porous sheet were bonded under a pressure of 8 MPa for 20 min. Bonding strengths were about 0.5 MPa, 1.0 MPa, 1.8 MPa, and 4.8 MPa at annealing temperatures of 100°C, 150°C, 200°C, and 250°C, respectively. The sheet which had about 10 nm ligament formed on the surface by additional treatment of immersing in liquid nitrogen was also used as a bonding layer. This treatment was effective to increase the bonding strength.

本文言語English
ホスト出版物のタイトル2012 2nd IEEE CPMT Symposium Japan, ICSJ 2012
DOI
出版ステータスPublished - 2012
イベント2012 2nd IEEE CPMT Symposium Japan, ICSJ 2012 - Kyoto, Japan
継続期間: 2012 12 102012 12 12

出版物シリーズ

名前2012 2nd IEEE CPMT Symposium Japan, ICSJ 2012

Conference

Conference2012 2nd IEEE CPMT Symposium Japan, ICSJ 2012
国/地域Japan
CityKyoto
Period12/12/1012/12/12

ASJC Scopus subject areas

  • ハードウェアとアーキテクチャ
  • 電子工学および電気工学

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