Vacuum packaging for microsensors by glass-silicon anodic bonding

H. Henmi*, S. Shoji, Y. Shoji, K. Yoshimi, M. Esashi

*この研究の対応する著者

研究成果: Article査読

195 被引用数 (Scopus)

抄録

Vacuum packaging by the glass-silicon anodic process is studied. The residual gas generated during the anodic binding process and that desobed from the silicon and glass surface increase the pressure in a sealed cavity. In order to fabricate a vacuum sealed cavity, two methods are proposed to eliminate the residual gas; (i) the residual gases are evacuated through a small opening after bonding and then the opening is plugged by depositing a material in vacuum, (ii) the residual gases are absorbed by a getter inside the sealed cavity. A non-evaporable getter (NEG) is used for the second method. A vacuum sealing of tens of Torr is obtained by the firat method. The second method and a combnation of the two methids enables vacuum sealing at a pressure lower than 10-5Torr. A prototype of a capacitive vacuum sensor is fabricated by using the second method.

本文言語English
ページ(範囲)243-248
ページ数6
ジャーナルSensors and Actuators: A. Physical
43
1-3
DOI
出版ステータスPublished - 1994 5月
外部発表はい

ASJC Scopus subject areas

  • 電子材料、光学材料、および磁性材料
  • 器械工学
  • 凝縮系物理学
  • 表面、皮膜および薄膜
  • 金属および合金
  • 電子工学および電気工学

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