Void formation and reliability in gold-aluminum bonding

T. Uno, K. Tatsumi, Y. Ohno

研究成果: Conference contribution

26 引用 (Scopus)

抜粋

Voids formed in gold-aluminum intermetallic compounds are known to degrade the long-term reliability of gold wire bonds to aluminum pads. We have investigated the diffusion behavior in the bonds annealed at elevated temperatures. The annealing environment has great influence on the voiding as well as the intermetallic formation. The ball bonds to aluminum pads after annealing in gaseous environments (Ar, N2, Ar+3%H2, Ar+500ppmO2 and air) exhibited sizable voids in the gold/compound interface causing the bond failure. However in the case of vacuum annealing the shear strength increases. The compound layer grows uniformly across the entire interface. There are no deleterious voids observed. It is confirmed that high reliability in the gold/aluminum interface can be obtained by vacuum annealing. Effects of the thickness of aluminum pads and bonding conditions on the voiding have been investigated.

元の言語English
ホスト出版物のタイトルAmerican Society of Mechanical Engineers, EEP
出版者Publ by ASME
ページ771-777
ページ数7
ISBN(印刷物)0791807665
出版物ステータスPublished - 1992 12 1
外部発表Yes
イベントProceedings of the 1992 Joint ASME/JSME Conference on Electronic Packaging. Part 2 (of 2) - Milpitas, CA, USA
継続期間: 1992 4 91992 4 12

出版物シリーズ

名前American Society of Mechanical Engineers, EEP
2

Other

OtherProceedings of the 1992 Joint ASME/JSME Conference on Electronic Packaging. Part 2 (of 2)
Milpitas, CA, USA
期間92/4/992/4/12

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Mechanical Engineering

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  • これを引用

    Uno, T., Tatsumi, K., & Ohno, Y. (1992). Void formation and reliability in gold-aluminum bonding. : American Society of Mechanical Engineers, EEP (pp. 771-777). (American Society of Mechanical Engineers, EEP; 巻数 2). Publ by ASME.