Void-free trench-filling by electroless copper deposition using the combination of accelerating and inhibiting additives

Madoka Hasegawa*, Yutaka Okinaka, Yosi Shacham-Diamand, Tetsuya Osaka

*この研究の対応する著者

研究成果: Article査読

42 被引用数 (Scopus)

抄録

Electroless copper deposition was performed on submicrometer-trench patterned substrates with a bath containing 8-hydroxy-7-iodo-5-quinoline sulfonic acid (HIQSA) as an accelerating additive and polyethylene glycol (PEG) as an inhibiting additive. Void-free copper filling of trenches was achieved by the addition of both HIQSA and PEG at specific concentrations. Copper deposition rate measurements revealed that HIQSA accelerated the deposition only when it was added together with a very low concentration of PEG. The void-free filling is considered to have resulted from the significant acceleration brought about by HIQSA at the trench bottom, where the concentration of PEG is low.

本文言語English
論文番号008608ESL
ページ(範囲)C138-C140
ジャーナルElectrochemical and Solid-State Letters
9
8
DOI
出版ステータスPublished - 2006 8 1

ASJC Scopus subject areas

  • 化学工学(全般)
  • 材料科学(全般)
  • 物理化学および理論化学
  • 電気化学
  • 電子工学および電気工学

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