Void-free trench-filling by electroless copper deposition using the combination of accelerating and inhibiting additives

Madoka Hasegawa, Yutaka Okinaka, Yosi Shacham-Diamand, Tetsuya Osaka

研究成果: Article

36 引用 (Scopus)

抄録

Electroless copper deposition was performed on submicrometer-trench patterned substrates with a bath containing 8-hydroxy-7-iodo-5-quinoline sulfonic acid (HIQSA) as an accelerating additive and polyethylene glycol (PEG) as an inhibiting additive. Void-free copper filling of trenches was achieved by the addition of both HIQSA and PEG at specific concentrations. Copper deposition rate measurements revealed that HIQSA accelerated the deposition only when it was added together with a very low concentration of PEG. The void-free filling is considered to have resulted from the significant acceleration brought about by HIQSA at the trench bottom, where the concentration of PEG is low.

元の言語English
記事番号008608ESL
ジャーナルElectrochemical and Solid-State Letters
9
発行部数8
DOI
出版物ステータスPublished - 2006 8

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Sulfonic Acids
sulfonic acid
quinoline
Polyethylene glycols
glycols
polyethylenes
Copper
voids
copper
Acids
Deposition rates
low concentrations
baths
Substrates

ASJC Scopus subject areas

  • Electrochemistry
  • Materials Science(all)

これを引用

Void-free trench-filling by electroless copper deposition using the combination of accelerating and inhibiting additives. / Hasegawa, Madoka; Okinaka, Yutaka; Shacham-Diamand, Yosi; Osaka, Tetsuya.

:: Electrochemical and Solid-State Letters, 巻 9, 番号 8, 008608ESL, 08.2006.

研究成果: Article

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